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Changes to Step #11

Edit by Taylor Dixon

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[* black] More heat, prying (a lot of prying), and a pair of pliers later, the inner case slides free of the outer case.
[* black] Looks like there's some kind of waterproof coating on the motherboard.
[* black] Plus, there's that modular charging port from last year!
[* black] One last heat-and-pry session and the motherboard is free! We immediately notice that it is more ... goopier ... than the [guide|75578|gen 1 board|stepid=152781|new_window=true] that emerged from the wreckage of the last 'pod fiasco.
[* black] Goop = waterproof
[* black] Beneath the shiny liquid-resistant coating we make out some chips:
[* red] chips

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