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Changes to Step #5

Edit by Jeff Suovanen

Edit approved by Jeff Suovanen

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After
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Step Lines

[* black] Slide the opening pick from the bottom right corner along the side to the top.
- [* icon_caution] [guide|25705|Reuse an iOpener|new_window=true] if the adhesive becomes hard to cut. During the removal process the back cover is under tension all the time and is likely to break if the adhesive isn't loose enough.
+ [* icon_caution] [guide|25705|Apply more heat|new_window=true] if the adhesive becomes hard to cut. During the removal process, the back cover is under tension all the time and is likely to break if the adhesive isn't softened enough.
[* black] Slide the opening pick around the corner and cut the remaining adhesive at the top of the phone.
-[* icon_caution] Don't open the phone all the way yet. The flex cable of the fingerprint sensor on the back is still connected to the motherboard.
+[* icon_caution] Don't open the phone all the way yet. The fragile fingerprint sensor cable still connects the back cover to the motherboard.