Changes to Step #2
Edit by Arielle Sampson —
Edit approved by Arielle Sampson
- Before
- After
- Unchanged
Step Lines
- | [* black] |
---|---|
- | [* |
- | [* |
+ | [* black] Place a heat shield over the other parts of the motherboard to avoid overheating. |
+ | [* black] Heat the affected area with a heat gun to reflow the solder. |
+ | [* icon_note] Reflowing heats up all the soldering joints in an area so they become liquid enough to reinforce the bonds. This allows electricity to flow through the bond without unexpected resistance. |