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Fix Your Stuff

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Changes to Step #15

Edit by TechGeos1019

Edit declined by Jeff Suovanen

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[* black] More chips on the underside of the logic board:
[* red] Qualcomm PM8018 RF power management IC
[* yellow] Hynix H2JTDG2MBR (or Toshiba THGBX26702JLA01) 128 Gb (16 GB) NAND flashflash*
[* yellow] Hynix H2JTDG2MBR (or Toshiba THGBX26702JLA01) 128 Gb (16 GB) NAND flashflash*
[* orange] Apple 338S1131 dialog power management IC*
[* green] Apple 338S1117 Cirrus Logic Class D Amplifiers. The die inside is a Cirrus Logic device (second image) but it does not look like the audio codec.
[* blue] STMicroelectronics L3G4200D (AGD5/2235/G8SBI ) low-power three-axis gyroscope—same as seen in the iPhone 4S, iPad 2, and other leading smart phones
[* violet] Murata 339S0171 (based on Broadcom BCM4334) Wi-Fi module