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Changes to Step #15

Edit by Jim Morrison

Edit approved by Jim Morrison

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[* black] More chips on the underside of the logic board:
[* red] Qualcomm PM8018 RF power management IC
[* yellow] Hynix H2JTDG2MBR 128 Gb (16 GB) NAND flash
[* orange] Apple 338S1131 Dialog Semi Power Management IC
[* orange] Apple 338S1131 Dialog Semi Power Management IC
[* green] Apple 338S1117 (Chipworks believes this to be an Elpida memory MCP for LTE.
[* blue] STMicroelectronics L3G4200D (AGD5/2235/G8SBI ) low-power three-axis gyroscope—same as seen in the iPhone 4S, iPad 2, and other leading smart phones
[* violet] Murata 339S0171 Wi-Fi module