Changes to Step #12
Edit by Andrew Bookholt —
- Before
- After
- Unchanged
Step Lines
| [* black] If necessary, use a spudger to pry up the left edge of the logic board to separate the solidified thermal paste from the heat sink. | |
| - | [* icon_note] If any resistance is felt when prying up on the logic board, recommend softening the thermal paste with a |
| + | [* icon_note] If any resistance is felt when prying up on the logic board, we recommend softening the thermal paste by heating the board with a hair dryer before prying further. |