Changes to Step #12
Edit by Walter Galan —
- Before
- After
- Unchanged
Step Lines
[* black] If necessary, use a spudger to pry up the left edge of the logic board to separate the solidified thermal paste from the heat sink. | |
- | [* icon_note] If |
+ | [* icon_note] If any resistance is felt when prying up on the logic board, recommend softening the thermal paste with a blow dryer or a heat gun before prying further. |