Parts

No parts required.

Place prying device along the side crease of the phone. Place prying device along the side crease of the phone.
  • Place prying device along the side crease of the phone.

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Slide the prying device downward to disjoin the rear casing from the front casing. Continue around all edges. Slide the prying device downward to disjoin the rear casing from the front casing. Continue around all edges.
  • Slide the prying device downward to disjoin the rear casing from the front casing. Continue around all edges.

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Remove the back casing from the front casing. Force may be necessary.
  • Remove the back casing from the front casing. Force may be necessary.

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Use prying device to remove motherboard from the back of the phone. Use prying device to remove motherboard from the back of the phone.
  • Use prying device to remove motherboard from the back of the phone.

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Conclusion

To reassemble your device, follow these instructions in reverse order.

Erica

Member since: 10/14/2011

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Team

James Madison, Team 1-49, Allen Fall 2011 Member of James Madison, Team 1-49, Allen Fall 2011

JMU-ALLEN-F11S1G49

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