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Introduction

REWA LAB has been constantly working on mobile phone repair solutions. Whether it is as simple as broken screen replacement or as complicated as chip-level motherboard repair. With the development of science and technology, mobile phone repair solutions are also constantly improving. Today we will show you how to upgrade the storage of iPhone X from 64GB to 256GB with the help of iRepair DFU Box instead of traditional NAND chip programmers.

Video Overview

  1. Here we have an iPhone X motherboard with 64GB storage and we need to upgrade the storage from 64GB to 256GB.
    • Here we have an iPhone X motherboard with 64GB storage and we need to upgrade the storage from 64GB to 256GB.

    • Let’s assemble the phone and test. We can see current storage capacity here - 64GB.

  2. We need to back up the underlying data of the original 64GB NAND first. We will use iRepair DFU Box today to back up the data without removing the NAND flash chip.
    • We need to back up the underlying data of the original 64GB NAND first. We will use iRepair DFU Box today to back up the data without removing the NAND flash chip.

    • Connect iRepair DFU Box to the computer. Then connect the phone with iRepair DFU Box. Put the phone into DFU mode.

  3. Click ‘DFU Model’. The phone will enter into purple mode. Continue to click ‘Query Info’ to check the underlying data.
    • Click ‘DFU Model’. The phone will enter into purple mode. Continue to click ‘Query Info’ to check the underlying data.

    • Then click ‘back up SYSCFG’ to back up the underlying data. Once done, click ‘Exit recovery mode, Exit diagnosis’.

    • Disconnect the phone. The phone will turn on automatically.

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  5. Disconnect the battery and remove the display assembly. Take out the motherboard. Attach the motherboard to the PCB Holder.
    • Disconnect the battery and remove the display assembly. Take out the motherboard. Attach the motherboard to the PCB Holder.

    • Stick high-temperature tape on components around NAND. Remove black adhesive around NAND with Hot Air Gun. Once done, keep the nozzle close to the NAND and heat with Hot Air Gun for about 30s.

    • Pry up the NAND flash chip carefully. Then clean the bonding pad carefully.

  6. Place the brand new 256GB NAND on the repair platform. Get the BGA Reballing Stencil in position. Smear medium-temp solder paste evenly on the stencil.
    • Place the brand new 256GB NAND on the repair platform. Get the BGA Reballing Stencil in position. Smear medium-temp solder paste evenly on the stencil.

    • Heat with Hot Air Gun so that all solder balls can shape up completely. Once completed, wait for 1 minute.

    • Then separate the NAND flash chip from the stencil. Heat again to ensure the formation of solder balls.

  7. Apply some BGA paste flux to the bonding pad. Get the 256GB NAND in the right position. Solder with Hot Air Gun.
    • Apply some BGA paste flux to the bonding pad. Get the 256GB NAND in the right position. Solder with Hot Air Gun.

  8. Get the motherboard installed and display assembly connected. Connect the battery.
    • Get the motherboard installed and display assembly connected. Connect the battery.

    • Connect the phone with computer. Restore the phone with the help of 3U Tools. Once finished, the phone turns on automatically.

    • Since the original NAND data hasn’t been written to the 256GB NAND, the serial number here is WLWLWLWLWLWL.

  9. Connect iRepair DFU Box to the computer. Then connect the phone with iRepair DFU Box. Put the phone into DFU mode.
    • Connect iRepair DFU Box to the computer. Then connect the phone with iRepair DFU Box. Put the phone into DFU mode.

    • Click ‘DFU Model’. The phone will enter into purple mode. Continue to click ‘Restore Data’.

    • Write the underlying data stored in the computer to the 256GB NAND. Once done, click ‘Query Info’ to check the underlying data.

    • If the Wi-Fi module has been replaced during the repair process, we can click the ‘Unlock WIFI’ button here to unbind WiFi directly. In this way, we needn’t remove the NAND flash chip.

    • Once finished, click ‘Exit recovery mode, Exit diagnosis’.

  10. Disconnect the phone. The phone turns on automatically.
    • Disconnect the phone. The phone turns on automatically.

    • Insert the SIM card. Connect the phone to the computer. Activate the phone directly with 3U Tools.

    • The storage capacity has been upgraded to 256GB successfully.

    • Spread out the dialer board and make a phone call. All going well.

    • Once the underlying data has been written to the new NAND flash chip, if the phone cannot activate normally, we can just restore the phone.

Phryne

Member since: 11/17/2019

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