Introduction
After removing the Secondary Board on your device you should be exposed to the speaker. Now you are able to remove them. As a precautions ground yourself to prevent frying the internal components. Also make sure to keep track of screws and label them.
What you need
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Use the plastic tool to pry between the silver bezel and the back case
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Work the tool around the device to free the back case
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Use a plastic opening tool to lift the black retaining flap on the ZIF Connector
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Using the plastic prying tool, lift the small retaining flap on the ZIF Connectors holding the ribbon cables to the motherboard
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To remove the ribbon cables, lift up the white retaining flap on the ZIF Connectors with a plastic pry tool
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To reassemble your device, follow these instructions in reverse order.
To reassemble your device, follow these instructions in reverse order.
Team
USF Tampa, Team 2-2, Cagle Fall 2016 Member of USF Tampa, Team 2-2, Cagle Fall 2016
USFT-CAGLE-F16S2G2
4 Members
5 Guides authored
