What temperature should I use for desoldering a component?
I need to replace a mosfet on my motherboard. I have my hot air gun at 380c and 35% airflow. the MOSFET isn't coming off
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MOSFETS got a high surface that allows to dissipate the temperature. That process will be tricky also because of usage of non-PB solder. 380C set would be ~330-340 effective heat on the component, which is barely enough to solder, and way to low for desoldering such heat dissipating element. Be careful thou, because glass-resin PCBs likes to boil at higher temps, which is deadly for multi-layer ones like in laptops. Consider pre-heating whole PCB with a heatbed or just the area around the component with air gun.
What I would do:
- Lots of lots of flux.
- Add solder tin with PB using your iron to lower the melting temperature - especially at the gate/ground/NC-radiator-pin (whatever it is the largest surface)
- Take away most of the tin
- Reapply flux. Lots.
- Heat it up with air ~400-420 should be fine if you would be fast.
Good luck!
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Cranking the heat to 420c and heating the area worked. Thank you very much.
