fernanda, start with this site and check their data sheets. They do contain the information needed. Here is a great site with plenty of info like this " To reball the PS3 GPU using the Puhui T-870A, with the board about 4 cm above the preheat plate, and the lamp nozzle about 1.5 to 2 cm above the chip, set the plate to 170 degrees Celsius and turn on. Then wait for the topside sensor (placed at the base of the chip against the motherboard), to top out at around 145 degrees Celsius (about 33 minutes for me at a room temperature of about 23 degrees Celsius). Set the lamp to 250 degrees Celsius and turn on. The chip should come off in about 1 minute. Turn lamp off immediately. Turn off preheat plate. Clean off all solder using, the gel flux, the Goot Wick, and a knife style solder iron tip (you may want to start with just the solder iron and a desolder pump). I also use the hot air wand to help prevent cooling which would allow the wick to become soldered to the board or chip. If the wick gets soldered, melt the solder with the hot air wand to avoid pulling off the contact pads. Once the board and chip are cleaned and the chip is reballed, repeat removal procedure, without removing the chip. Don't forget you're attaching it this time round, not removing it." Of course you will also need the right stencils etc. They are available at sites like this one. Hope you get it done, let us know (take plenty of pictures too)Good Luck to you.