Question about the iPhone ICs and soldering
I'm going to make a transplant of all ICs from broken board to a new without any IC but i have questions about this to help me to make this is the questions:
What the good temperature and air speed good to soldering in a new board and remove the components from the broken board ?
I need reball all ICs or i can only soldering on a new board (The new board has balls to soldering on ICs socket) ?
I can use the liquid flux to soldering or i need to use the paste flux ?
To clean the board i can use the Isopropyl Alcohol?
Really very thanks by your help!
Is this a good question?