iPhone 6 NAND data recovery
I've got a customer's iPhone 6 board (yes, only the board) and she would like to retrieve the data. The board is cracked near the battery connector (long history) and not working.
I've read some comments about transfer NAND and CPU to another board and I would like to try this.
So, my first doubt is about the components. I need to access the data, what is the IC that I need to transfer?
My second doubt is about the techniques. I have a good iPhone 6 board and some tools (hot gun esd safe, stencil for re-ball, scalpel, esd safe working table, etc), but I would like some tips about correct temperature to scrape the resin and take off the IC .
And the last is about how to get the correct alignment for this IC.
I am not totally untrained about it, I replaced and re-baling some x-box cpu, but it is other size and resin ...
Is this a good question?