Solder wick is an really old school technique for cleaning old solder from a pcb. Think about it, people were wicking pcb's back in the day of giant through-hole components on thick single-sided or double-sided pcb's.
A modern smartphone or tablet logic board is barely 1mm thick and has 10 layers of traces with tiny pads of ~0.3mm diameter. So what you end up having is very thin copper traces, very thin pcb's and very high component density. The longer you apply heat to the board, the more you damage the adhesion of these tiny pads. When you add the abrasion and friction from wicking, you lift pads very easily.
Additionally, I believe you are applying too much heat (450C is too high, aim for ~380, adjust as necessary) and based on your 5th picture, the tip is much too large. The J-Tip is better. What I prefer to use is a concave tip ( I use the Hakko T15-BCM2) and let the "well" suck up the excess solder on the pads. I don't aim to scrub it clean, just keep the surface as flat as possible for the next chip.