Any micro-soldering repair always contains an element of risk. This varies depending on you level of skill, experience and tools available as well as the complexity of the repair. You don't say much about your experience or the tools you used so I can only generalize.
If you used hot air to remove the crystal, you may have overheated the PMIC and popped some solder balls. Look for tiny solder balls in the vicinity of the PMIC. You may also have dislodged or blown away some surrounding passive components. Take a close look at the logic board and probe the components to see if they are solidly anchored.
The Touch IC's are pretty far away so they would not normally be affected by a Y2 repair, unless you applied massive amounts of heat.
Comment on my answer (so that I get notified) and I can hopefully give you more feedback.