You can try the baking method, but even if it works, it will only last for a very short time. I tried and it worked for about 5 minutes. I am going to flood the chip with flux and try again, but Im probably pushing chain. The lead free solder they use requires around 220C for about 5 minutes to soften. Quite a bit hotter than lead/tin which has worked very well for a very long time until idiots like Al Gore came along. The Ball Grid Array is a very bad idea IMHO. it depends on solder being used as the conductor, and solder can crack under thermal stress (Especially the crap they use) It is not like soldering a wire lead, where the wire has tensile strength, and the solder merely coats the wire. Another bad idea by a bad engineer with no grasp of the physical properties of materials. I see this more and more today, don't you?
LG has no idea what they are doing. They should get out of the consumer electronics business. Very poor QC