Heat Sink/Cooling solution employed on main board.
Many Nexus 7 2013 users are noticing a distinct increase in heat in the processor area (which is to be expected in most cases). What I'd like to know is the type of heat sink/cooling solution ASUS decided to use in this device.
I'd almost be inclined to run this device with the back off if I was using a custom case to improve ventilation. It seriously cooks.
Is this a good question?