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Add Note Edit Step 9  ¶ 

  • We use the flat end of a spudger to pry up the battery from some typical adhesive.

  • For the iPhone 5, Apple has switched to a different battery chemistry, with a higher voltage and slightly larger capacity than the iPhone 4S. Let's see how the battery specs stack up.

    • iPhone 5 Battery: 3.8V - 5.45Wh - 1440mAh. Talk time: Up to 8 hours on 3G. Standby time: Up to 225 hours.

    • iPhone 4S Battery: 3.7V - 5.3Wh - 1432mAh. Talk time: Up to 8 hours on 3G. Standby time: Up to 200 hours.

    • Samsung Galaxy S III Battery: 3.8V - 7.98Wh - 2100mAh. Talk time: Up to 11 hours 40 minutes on 3G. Standby time: Up to 790 hours.

  • On the back of the battery we notice "MFR Sony," and "Cell made in Singapore." A bit of googling and it looks very likely that Sony is manufacturing this battery.

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Add Note Edit Step 10  ¶ 

  • There are all kinds of metal-to-metal contacts inside the iPhone 5.

    • Spring contacts make for easy repairs, but mandate careful attention to cleaning all the parts before reassembly. Finger oils can get in the way of these metal contacts and cause frustrating component failures.

  • This contact connects the metal frame around the front-facing camera to the frame around the rear-facing camera. Maybe this frame is some kind of an antenna? Only time will tell.

  • Speaking of antennas, a spudger easily pries one end of an antenna connector off of the logic board near the battery.

    • In the iPhone 4S, this antenna location was reserved for the cellular antenna. We won't know for sure what this antenna's purpose is until we uncover more.

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Add Note Edit Step 11  ¶ 

  • Near the top of the case, we find a few antenna connectors firmly screwed to the inside of the case.

  • Finally free of its constraints, we lift the logic board up out of the rear case.

  • The logic board and 8 megapixel iSight camera come out together, leaving several components behind in the rear case—another win for modularity.

    • +1 for repairability.

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Add Note Edit Step 12  ¶ 

  • They said if us tech writers were good and we stayed late, we can have one beverage of choice when we finished the teardown.

  • Then they promptly took the beverages away…

  • and put them in the fridge!!!

  • We Я happy camperz.

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Add Note Edit Step 13  ¶ 

  • Many of the components that came out with the logic board are held in place with screws and brackets.

    • Apparently, Apple is very concerned with making sure that all the connectors are firmly seated and won't rattle loose over time. Good on you, Apple.

  • Before we go any further: A mega thanks to Chipworks for sticking around into the wee hours of the night and helping us identify the packages on the logic board. Their handiwork (along with ours!) can be seen below.

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Add Note Edit Step 14  ¶ 

  • The underside of the logic board is teeming with components.

    • Skyworks 77352-15 GSM/GPRS/EDGE power amplifier module

    • SWUA 147 228 is an RF antenna switch module

    • Triquint 666083-1229 WCDMA / HSUPA power amplifier / duplexer module for the UMTS band

    • Avago AFEM-7813 dual-band LTE B1/B3 PA+FBAR duplexer module

    • Skyworks 77491-158 CDMA power amplifier module

    • Avago A5613 ACPM-5613 LTE band 13 power amplifier

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Add Note Edit Step 15  ¶ 

  • More chips on the underside of the logic board:

    • Qualcomm PM8018 RF power management IC

    • Hynix H2JTDG2MBR 128 Gb (16 GB) NAND flash

    • Apple 338S1131 dialog power management IC*

    • Apple 338S1117 Cirrus Logic Class D Amplifiers. The die inside is a Cirrus Logic device (second image) but it does not look like the audio codec.

    • STMicroelectronics L3G4200D (AGD5/2235/G8SBI ) low-power three-axis gyroscope—same as seen in the iPhone 4S, iPad 2, and other leading smart phones

    • Murata 339S0171 Wi-Fi module

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Add Note Edit Step 16  ¶ 

  • Now for the pièce de résistance: the A6 application processor.

  • The A6 processor is the first Apple System-on-Chip (SoC) to use a custom design, based off the ARMv7 instruction set.

  • Because the A6 is not an ARM-specific CPU design, this gives Apple the ability to tailor the A6 towards their needs.

  • According to Chipworks, the B8164B3PM silkscreen label denotes 1GB Elpida LP DDR2 SDRAM.

    • Contrarily, the infographic presented during Apple's Keynote clearly showed Samsung RAM (K3PE7E700F) in the A6.

    • Not too long ago, Apple decided to reduce the number of RAM chip orders from Samsung. Time to invest in Elpida? Or is Samsung lurking in the next phone on the shelf? That's for you to decide.

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