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Add Note Edit Step 9  ¶ 

  • Wow, what gorgeous symmetry.

  • The display assembly and rear case assembly are each 350g. Talk about 50/50 weight distribution.

  • The empty void in the upper right corner is where the cellular communications board will go in the 3G iPad.

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Add Note Edit Step 10  ¶ 

  • The display has a marking referencing Honeywell patent #5280371.

  • It looks pretty barren, mostly because all the 3G equipment is missing.

  • The 3.75V, 24.8 watt-hour battery provides the juice for an advertised 10 hours of use. In contrast, the iPhone 3GS has a 4.51 watt-hour battery and the MacBook Air has a 40 watt-hour battery.

  • The USB power supply had to be enhanced specifically for the iPad. It's a 10W unit manufactured by Foxlink Technology, Ltd., part #A1357 W010A051.

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Add Note Edit Step 11  ¶ 

  • Disconnecting the display data cable.

  • Removing these connectors is a two step process. You first have to flip up the locking bar (pictured) and can then slide the cable out of the socket.

  • The display data cable connector is the same style used in all of the new Unibody MacBooks.

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Add Note Edit Step 12  ¶ 

  • Disconnecting the volume, power, and screen rotation lock buttons connector.

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Add Note Edit Step 13  ¶ 

  • The main board is secured to the back panel by T4 Torx screws.

  • We have never seen Apple use screws with a bit this small before.

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Add Note Edit Step 14  ¶ 

  • Top and bottom of logic board with the EMI shield on.

  • It looks like this board was made by AT&S. We haven't seen Apple's PCB manufacturers brand their boards before.

  • The logic board is about 4.5" wide, spanning about 60% of the iPad's width.

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Add Note Edit Step 15  ¶ 

  • Remove the EMI shield from the logic board, and presto!

  • This board is markedly different than the pre-production board we uncovered.

  • Markings on the A4:

    • N26CGM0T 1007 APL0398 33950084 YNL184A2 1004 K4X2G643GE

    • Yes, the K4X2 is a Samsung DRAM part number!

      • Decoding the part number shows there is 2Gb of memory inside. This translates into ~128MB of memory per die, for 256 MB total. (NOT 512MB, as we previously reported.)

    • This means the A4 processor is probably being manufactured by Samsung.

    • The DRAM was stamped at the end of January, while the processor die was likely manufactured the third week of February.

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Add Note Edit Step 16  ¶ 

  • A shot of the logic board minus the steel EMI shield.

  • The manufacturer of the memory has switched from Toshiba on the FCC teardown to Samsung on this device.

    • Samsung K9LCG08U1M 8 GB NAND flash.

    • We love how much easier Samsung's chip numbers are to interpret.

  • Broadcom BCM5973 I/O controller.

  • The Apple A4 is marked up much nicer than the part in the FCC photos from yesterday.

  • Texas Instruments CD3240A1 touch screen controller.

  • NXP: L061 01 4 ZSD950

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