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Next, cut the processor in half to take a cross-section photo.

Band saws are much too crude for this, so we actually grind through the processor slowly, taking off very small amounts of material as we go.

You can see why it can be tough to take a clear, solid photo of a package's cross-section. The processor is actually one of the larger packages in the iPhone, and still very finicky to handle. Imagine trying to do this with a package a tenth of its size.

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