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The Murata Wi-Fi SoC module actually comprises a Broadcom BCM4334 package in addition to an oscillator, capacitors, resistors, etc. You can see all the components in the X-ray (third image).
Murata assembles all of the components together and sends their package to Foxconn, where it eventually ends up on the iPhone's logic board. Chipworks said it best: "Murata makes a house that is full of other people's furniture."
Here are the die images for the Broadcom BCM4334, fabricated in Taiwan at TSMC on a 40 nm CMOS process. Its key features:
Wi-Fi (802.11 a/b/g/n)
Bluetooth 4.0 + HS
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