The 4.3-inch super Amoled Plus display is simply gorgeous!

Look at how slim the phone is! Only 8.49mm thin!

Back cover is flexible but don't worry it will not break. It also has a nice texture to it.

Look at how compact everything is inside!

Remove the seven visible screws.

Then unclip the back panel starting on the left next to the audio jack. Go slowly.

Removing the back panel gives you an impressive and sophisticated view of the internals.

Removing the motherboard is as simple as it looks !

Unclip the 5 ribbon connectors and the antenna cable.

Then remove the 2 small black screws.

Don't forget to unglue the volume flex and power flex, they are attached to the motherboard. Other way the motherboard won't come out easily like it should.

The board with removed EMI shields.

The front.

..and the back.

The front panel without the logic board.

The front facing camera part, the cinch-vibrator-1.mic part and the usb connection-2.mic-antenna board.

The camera connector is at the upper left corner in the second picture.

The power and volume buttons are soldered to the logic board.

View the picture in HQ if you want to be impressed!

This EMI shield is nearly a heat sink.

Should be useful with a 1.2GHz dual core under it!

The (tiny) 8MP camera.

It's smaller than an iPhone 4 camera.

The front-facing camera and the light sensor are a single part.

The front-facing camera is 2MP, which is better than the iPhone 4's VGA camera.

The vibrator, first mic (did you know there are two?), cinch plug and the earspeaker.

The USB-connection and 2 x mic board.

It's stuck with glue to the front panel.

The (only) antenna cable and a metal shield holding the light sensor in place.