iFixit

Removing four more small connectors, and the main logic board is finally free.

Like the original iPhone, the Pre has two main boards, the logic board and the communications board.

Unfortunately, everything interesting is carefully hidden beneath metal EMI shields. Not only are the shields soldered to the board, there's epoxy holding them down as well. Palm definitely didn't make it easy to see what makes the Pre tick.

Finally, prying the logic board out.

The Pre is definitely not an easy phone to service. There are lots of fragile and tricky tabs that will make putting the phone back together challenging.

We wish manufacturers would put more effort into making their devices easily repairable.

This is an incredibly thin, flexible PCB.

The Pre has an integrated 3 megapixel digital camera with LED flash.

The camera is one of our biggest complaints with the iPhone. The iPhone suffers from both poor quality photos and a long shutter delay. While the quality is definitely improved on the Pre, it's still pretty slow snapping photos.

You can see the standard phone vibrator next to the camera.

Internal components, from left to right:

• Earpiece speaker, LCD display and digitizer, microphone, communications board.
• Original rear panel and plastic framework.
• Battery, internal metal framework and spring mechanism, keyboard.
• Camera board and main circuit board.
• Main plastic framework containing antennas, antenna cabling, and the surprisingly excellent speakerphone.

Communications board with high-resolution shots of the front and back.

Samsung K5D1257ACC-D090

Qualcomm MSM6801A

AVAG0 FEM-7788

0CEQ 86K H33F

The back of the display, complete with what appears to be a manufacture date at the beginning of January.

Unfortunately for repair, it doesn't look like the LCD and digitizer are easy to separate.

Both the iPhone and the Pre sport a HVGA display. However, the iPhone's display measures 3.5" diagonally, while the Pre's is only 3.1"

A high resolution version of this image.

Logic board with shielding removed (high res).

Chip markings:

• Texas Instruments TWL5030B 8CA28MWC
• Marvell WiFi chip under the silver EMI cover, marked W8686B12. Directly above it is the CSR bluetooth chip. They're both on a daughterboard soldered to the logic board.
• Samsung SDRAM KMCMG0000M-B998
• ELPIDA K2132C1PB-60-F 08510N060. Another BGA chip underneath this one is Texas Instruments OMAP3430.
• Unbranded chips: 3335A ADJ RNX, 89A8 850. And the one hidden with epoxy above Samsung's SDRAM is Kionix KXSD9 3-Axis Accelerometer.

The top of the board is labeled 888-3 94V0 1 309 - F3. The bottom of the board is bereft of chips or markings, something Apple has never done.