Image #1

Add Note Edit Step 9  ¶ 

  • The connectors as viewed, from left to right:

    • Wi-Fi/Bluetooth antenna

    • Camera cable

    • Optical drive

    • Speaker wires

    • Hard drive

  • Due to the redesign of the AirPort/Bluetooth interface, its connections are no longer integrated into the camera cable, greatly decreasing the size of the connector.

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Add Note Edit Step 10  ¶ 

  • With the antenna out of the way, the optical drive can be removed.

  • The new MacBook Pro uses the same Seagate hard drive from the previous model.

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Add Note Edit Step 11  ¶ 

  • Removing the speaker and subwoofer assembly requires removing four measly screws holding it on the upper case.

  • Apple changed the design of this speaker assembly slightly, moving from a single plastic enclosure to separate plastic enclosures for the speaker & subwoofer that are connected by the speaker leads.

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Add Note Edit Step 12  ¶ 

  • Since the AirPort/Bluetooth board is mounted inside the all-metal case of this machine, Apple added an antenna that is mounted on the frame for the optical drive opening. Pretty clever!

  • This antenna is not found on the MacBook Unibody, probably because the case of that machine is plastic and blocks less RF transmission & reception.

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Add Note Edit Step 13  ¶ 

  • After removing the two cooling fans and disconnecting many connectors, the logic board and DC-In board can be removed as one piece.

Image #1

Add Note Edit Step 14  ¶ 

  • The logic board and heat sink assembly by itself.

  • The speaker, microphone, and port layout are unchanged from previous MBP 15" Unibody machines.

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Add Note Edit Step 15  ¶ 

  • Huge versions of these scans can be found here and here. 56K beware!

  • Intel Core i5 processor with integrated graphics.

  • NVIDIA GeForce GT 330M. The OS switches to the NVIDIA graphics for higher demand applications.

  • Intel BD82HM55 S LGZS Platform Controller Hub. Interestingly enough, the hub is not connected to the heat sink. Apparently, enough heat is convected from the surface of the silicon to remove the small amount of heat generated by the graphics switching operations.

Image #1

Add Note Edit Step 16  ¶ 

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