What you need
Video Overview
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The phone has been dropped before and the screen is cracked. After boot-up, the phone shows a temperature warning.
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Next, we take apart the phone for testing. Disconnect the flex cables. Remove the motherboard. In the first place, we check if the motherboard is deformed. The motherboard is not deformed.
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It can be seen under the microscope that the motherboard has pseudo-soldering. Then we need to separate the motherboard.
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Detach the foam and plastic part. Put the motherboard on the 165 °C Heating Platform to heat. Since the middle layer of iPhone 12 lineup adopts middle-temperature solder paste for soldering, we need to assist the heating with a Hot Air Gun at 330 °C.
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Try to pry up the logic board with a Pry Blade while heating. If the logic board becomes loose, remove it. Then remove the signal board.
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Then scrape the missing pads to show the circuits with a Sculpture Knife. Please pay attention not to damage the GND while scraping.
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Clean the bonding pads with PCB Cleaner. Apply tin to the bonding pads with a Soldering Iron.
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Then we put the Soldering Lugs in position. Apply some Paste Flux. Heat with a Soldering Iron to solder. Clean the bonding pads with PCB Cleaner.
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Next, we reball the signal board. Attach the signal board to the holder. Put the reballing stencil in position. Apply some low-temperature Solder Paste evenly. Remove excess solder paste.
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Detach the reballing stencil. Put the motherboard on the 165 °C Heating Platform to heat for recombination. Remove the motherboard after it has cooled for 5 minutes.
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Install the motherboard for testing. Connect the screen. The phone turns on normally. The temperature warning has disappeared.
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To reassemble your device, follow these instructions in reverse order.
To reassemble your device, follow these instructions in reverse order.
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