there's power, or specifically, the TDP (Thermal Design Power), which refers to the heat dissipation capability of a particular CPU cooling system compatibility problems.
A small jump from one speed to another is possible - an Aluminum iMac with a socket-compatible processor that has the same, or lower, TDP as the originally installed processor.
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I was wondering how well the successful upgrades are doing after a few months. Are the machines still running well with no overheating problems?
I am looking to do the same with my mid 2010 i3 iMac since the i7 870 prices are dropping like stones.
Any updates especially around performance would be gratefully appreciated.
I successfully switched the i3 550 processor for the i7 870 and dropped a Samsung 830 SSD in there as well for good measure.
Machine is working perfectly with no issues.
To anyone else considering the upgrade, I would wholeheartedly recommend it, the performance of the machine for encoding video etc. has doubled.
It wasn't actually too difficult, on a scale of 1 to 10, with 10 being the hardest I would put it at about 4.
I'm sorry, there isn't a question link to use, but here goes.
the issue about TDP Thermal design power only seems to relate to whether the same cooling system is used by Apple, for the i3 and i7. It's not a logic board issue.
That said, does anyone know why the logic board for all 3 models have different sky numbers?